COMPANY PROFILE

BONDWARE TECHNOLOGIES PRIVATE LIMITED

CIN: U62010AP2026PTC125811
Status: Inactive for e-filing
Incorporated: 13/05/2026
, ,

₹100,000

Authorized Capital

₹100,000

Paid Up Capital

0

Years Old

BONDWARE TECHNOLOGIES PRIVATE LIMITED is a private company incorporated on 13/05/2026. The company is headquartered in , and operates in the Company limited by Shares sector.

Company Details
U62010AP2026PTC125811
Active
13/05/2026
N/A years
100,000
100,000
Private
Company limited by Shares
No
RoC-Vijayawada
N/A
N/A
Registered Address
H No 13-3-1121, East Baza, Nagendra Swamy Putta, Gorantla, Guntur, Guntur, Andhra Pradesh, India, 522034.
N/A
N/A
N/A
N/A
N/A
Complete Address:

H No 13-3-1121, East Baza, Nagendra Swamy Putta, Gorantla, Guntur, Guntur, Andhra Pradesh, India, 522034.

Financial Details

Financial information and company details

Available Financial Information
100,000
100,000
N/ANot Available
Inactive for e-filing
13/05/2026
N/ANot Available
Company Summary

BONDWARE TECHNOLOGIES PRIVATE LIMITED is a private company incorporated on 13/05/2026. The company has an authorized capital of ₹100,000and a paid-up capital of ₹100,000.

Company Directors

Board of directors and key management personnel

2Total Directors
2Active Directors
NAVEEN MAGULURI
Director
Active
DIN
11****74
PAN
N/A
Appointment Date
13/05/2026
Get PAN by DINContact by DINEmail to hide details
BHARATH VAMSI MAGULURI
Director
Active
DIN
11****75
PAN
N/A
Appointment Date
13/05/2026
Get PAN by DINContact by DINEmail to hide details

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